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Non-invasive nano-imaging of ion implanted and activated copper in silicon

Non-invasive nano-imaging of ion implanted and activated copper in silicon
Authors: F. Ballout, J.-S. Samson, D. A. Schmidt, E. Bründermann, Y.-L. Mathis, B. Gasharova, A. D. Wieck, M. Havenith
Source:

Journal of Applied Physics 110(2), 024307
DOI: 10.1063/1.3606415

Date: 2011