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High resolution 3D imaging of bump-bonds by means of synchrotron radiation computed laminography.

High resolution 3D imaging of bump-bonds by means of synchrotron radiation computed laminography.
Authors:

Cecilia A, Hamann E, Koenig T, Xu F, Chen Y, Helfen L, Ruat M, Scheel M, Zuber M, Baumbach T, Fauler A, Fiederle M

Source:

JINST, 8, C12029

Date: 2013