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Characterization of a 2x3 Timepix assembly with a 500 µm thick silicon sensor.

Characterization of a 2x3 Timepix assembly with a 500 µm thick silicon sensor.
Authors:

Zuber M, Koenig T, Hamann E, Cecilia A, Fiederle M, Baumbach T

Source:

JINST, 9, C05037

Date: 2014