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Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography

Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography
Authors: T. Tian, F. Xu, J. K. Han, D. Choi, Y. Cheng, L. Helfen, M. Di Michiel, T. Baumbach, K. N. Tu
Source: Applied Physics Letters 99, 082114
Date: 2011