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High resolution 3D imaging of bump-bonds by means of synchrotron radiation computed laminography

High resolution 3D imaging of bump-bonds by means of synchrotron radiation computed laminography
Authors: A Cecilia, E Hamann, T Koenig, F Xu, Y Cheng, L Helfen, M Ruat, M Scheel, M Zuber, T Baumbach, A Fauler and M Fiederle
Source: Journal of Instrumentation 8, C12029
Date: 2013