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Characterization of a 2x3 Timepix assembly with a 500 μm thick silicon sensor

Characterization of a 2x3 Timepix assembly with a 500 μm thick silicon sensor
Authors: M. Zuber, T. Koenig, E. Hamann, A. Cecilia, M. Fiederle, T. Baumbach
Source: Journal of Instrumentation 9, C05037
Date: 2014