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LIGA uses deep X-ray lithography with synchrotron radiation for the production of high aspect ratio polymer microstructures. By shadow printing an X-ray mask is copied into an X-ray sensitive resist. A chemical developer dissolves the irradiated areas. Free lateral shape, structures heights from 20 µm up to several millimetres, vertical sidewalls with optical quality (Ra < 20 nm) and sub µm structure details are the basic characteristics of this process step.

 

The microstructure laboratory at ANKA consists of three beamlines for deep x-ray lithography, each dedicated to a specific task in the LIGA-process. In this chapter we present the LIGA3 beamline, dedicated to ultra deep X-ray lithography (UDXRL). The typical data for the structural height ranges from 400 to 2000 microns.

 

  

Liga 3 gesamt Overview of the LIGA3 Beamline equiped with the DEX02 Scanner (Fa. JenOptik) installed under a flow box (class 1000)
   
liga 3 innen



Opened working chamber of LIGA3. The deep X-ray lithography mask is already mounted to the motorized stage. The sample (4"-Wafer clamped to the other chuck) is going to be fixed to the stage in front of th

Energy range
2.5 -15.0 keV
Source
1.5 T Bending magnet, bending radius: 5.556 m
Be-window
225 µm
Mirror
none
Distance: source point-mask plane
14.89 m
Distance: source point -mirror
none
Be-window aperture
20 mm (vertical) x  110 mm (horizontal)
Usable horizontal fan
108 mm
Sample environment
100 mbar He
Experimental setup
JenOptik DexKfK X-ray scanner with tilting option (+/- 60°)
power reduced exposure by using a chopper (optional)
 

Publications
Title Author Source Date Link

P. Meyer 

Microsystem Technologies - Micro- and Nanosystems - Information Storage and Processing Systems 18 (2012) 1971-1980 

2012 PDF

V. Nazmov, E. Reznikova, J. Mohr, V. Saile, L. Vincze, B. Vekemans, S. Bohic, A. Somogyi 

Journal of Micromechanics and Microengineering 21 (2011) 015020-1-11 

2011

V. Nazmov, J. Mohr, R. Simon 

J. Micromech. Microeng. 23, 095015 

2013 PDF