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LIGA uses deep X-ray lithography with synchrotron radiation for the production of high aspect ratio polymer microstructures. By shadow printing an X-ray mask is copied into an X-ray sensitive resist. A chemical developer dissolves the irradiated areas. Free lateral shape, structures heights from 20 µm up to several millimetres, vertical sidewalls with optical quality (Ra < 20 nm) and sub µm structure details are the basic characteristics of this process step.

 

The microstructure laboratory at ANKA consists of three beamlines for deep x-ray lithography, each dedicated to a specific task in the LIGA-process. In this chapter we present the LIGA3 beamline, dedicated to ultra deep X-ray lithography (UDXRL). The typical data for the structural height ranges from 400 to 2000 microns.

 

  

Liga 3 gesamt Overview of the LIGA3 Beamline equiped with the DEX02 Scanner (Fa. JenOptik) installed under a flow box (class 1000)
   
liga 3 innen



Opened working chamber of LIGA3. The deep X-ray lithography mask is already mounted to the motorized stage. The sample (4"-Wafer clamped to the other chuck) is going to be fixed to the stage in front of th

Energy range
2.5 -15.0 keV
Source
1.5 T Bending magnet, bending radius: 5.556 m
Be-window
225 µm
Mirror
none
Distance: source point-mask plane
14.89 m
Distance: source point -mirror
none
Be-window aperture
20 mm (vertical) x  110 mm (horizontal)
Usable horizontal fan
108 mm
Sample environment
100 mbar He
Experimental setup
JenOptik DexKfK X-ray scanner with tilting option (+/- 60°)
power reduced exposure by using a chopper (optional)
 

Publications
Title Author Source Date Link

V. Nazmov, J. Mohr, R. Simon 

J. Micromech. Microeng. 23, 095015 

2013 PDF

V. Nazmov, E. Reznikova, J. Mohr, V. Saile, L. Vincze, B. Vekemans, S. Bohic, A. Somogyi 

Journal of Micromechanics and Microengineering 21 (2011) 015020-1-11 

2011

P. Meyer 

Microsystem Technologies - Micro- and Nanosystems - Information Storage and Processing Systems 18 (2012) 1971-1980 

2012 PDF