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Dislocation generation related to micro-cracks in Si wafers: High temperature in situ study with white beam X-ray topography

Dislocation generation related to micro-cracks in Si wafers: High temperature in situ study with white beam X-ray topography
Authors:

A. N. Danilewsky, J. Wittge, A. Hess, A. Cröll, D. Allen, P. McNally, P. Vagovic, A. Cecilia, Z. Li, T. Baumbach, E. Gorostegui-Colinas, M. R. Elizalde 

Source:

Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 268 (2010) 399-402 

Date: 2010