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Combined use of three-dimensional X-ray diffraction imaging and micro-Raman spectroscopy for the non-destructive evaluation of plasma arc induced damage on silicon wafers

Combined use of three-dimensional X-ray diffraction imaging and micro-Raman spectroscopy for the non-destructive evaluation of plasma arc induced damage on silicon wafers
Authors:

J. Stopford, D. Allen, O. Aldrian, M. Morshed, J. Wittge, A. N. Danilewsky, P. J. McNally 

Source:

Microelectronic Engineering 88 (2011) 64-71 

Date: 2011