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Crack propagation and fracture in silicon wafers under thermal stress

Crack propagation and fracture in silicon wafers under thermal stress
Authors:

A. Danilewsky, J. Wittge, K. Kiefl, D. Allen, P. McNally, J. Garagorri, M. R. Elizalde, T. Baumbach, B. K. Tanner 

Source:

J. Appl. Cryst. 46, 849-855 

Date: 2013