Home | Legals | Sitemap | KIT

Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips.

Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips.
Authors:

C.S. Wong , A. Ivakovic, A. Cowley, N.S. Bennett, A.N. Danilewsky, M. Gonzalez, V. Cherman, B. Vandevelde, I. de Wolf, P.J. McNally

Source:

IEEE 64th Electronic Components and Technology Conference (ECTC) 2014

Date: 2014