Home | Legals | Sitemap | KIT

Dislocation generation related to micro-cracks in Si wafers: High temperature in situ study with white beam X-ray topography

Dislocation generation related to micro-cracks in Si wafers: High temperature in situ study with white beam X-ray topography
Authors: A. Danilewsky, J. Wittge, A. Hess, A. Cröll, D. Allen, P. McNally, P. Vagovic, A. Cecilia, Z. Li, T. Baumbach, E. Gorostegui-Colinas, M. R. Elizalde
Source: Nuclear Instruments and Methods in Physics Research B 268 (2010) 399-402
Date: 2010