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X-ray diffraction imaging for predictive metrology of crack propagation in 450-mm diameter silicon wafers

X-ray diffraction imaging for predictive metrology of crack propagation in 450-mm diameter silicon wafers
Authors:

B. K. Tanner, J. Wittge, P. Vagovic, T. Baumbach, D. Allen, P. J. McNally, R. Bytheway, D. Jacques, M. C. Fossati, D. K. Bowen, J. Garagorri, M. R. Elizalde, A. N. Danilewsky 

Source:

Powder Diffraction 28, 95-99 

Date: 2013